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thermocompression bonding
释义
thermocompression bonding
热压键合
装配积体电路的一种焊接工艺。焊接时从毛细管中引出金属细丝,在焊接部位将金属丝加热并将其压焊在焊接点上。热压键合有球焊、弯焊、楔焊等方式。
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sufferable
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suffer through
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sufficient
sufficiently
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Suffolk
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